Effects of Chloride and Surfactant Addition on the Copper Leaching During Medium-temperature Pressure Leaching of Chalcopyrite

When the pressure leaching process of chalcopyrite is operated in low and medium temperature range 90℃~150℃, sulfur component converted to elemental sulfur, which suppresses copper. In present study, copper rate was improved by adding chloride ions surfactants during medium-temperature at 150℃. Using autoclave equipped with a 2L reactor made titanium, leach tests were conducted for 180 min using 100g concentrate D90 particle sizes 10μm 45μm 5g/L 50g/L sulfuric acid solutions. At solution without ion surfactant, when sample size used, efficiency after 48%. As result 12g/L such as HCl, CuCl2, NaCl, efficiencies increased 96% 97%, respectively, HCl CuCl2. SLS (Sodium lignosulfonate) CLS (calcium lignosulfonate), over 99%. Consequentially, added solution.